| 摘要 |
In a process for repairing electronic device packages, the problem of removing solder remnants on substrate bonding pads is solved by, first, etching a pattern in silicon and metallizing the pattern to make a silicon wick. The solder remnants on the bonding pads are melted, and the etched pattern of the silicon wick is brought into contact with the remnants to remove them by capillary action. It is often convenient to heat the silicon wick so that solder remnants melt when the wick is brought into contact with them.
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