Epoxy compositions, and method of making same

摘要

An epoxy resin composition, especially useful as an encapsulant and exhibiting a low dissipation factor, is prepared from a first component comprising an epoxy of a polyglycidal ether of a polyhydroxyl phenol and filler, and a second component comprising a cycloaliphatic acid anhydride curing agent, filler and catalyst. Each component is mixed separately under high shear, and the filler for each component comprises at least about 50 percent by weight. The two components are admixed, applied as an encapsulant, and cured at an elevated temperature.