发明名称 PHOTORESIST COMPOSITION CONTAINING PHENOL RESIN AND PHOTOSENSITIVE AGENT
摘要 PURPOSE: To improve the resolving power, heat and plasma resistances of a photoresist compsn. and the solubility of the compsn. in a developer by using a specified phenolic resin. CONSTITUTION: In a compsn. contg. phenolic resin and a sensitizer, a polymer contg. units represented by formula I or a copolymer contg. units represented by formulae II, III is used as the phenolic resin and a compd. effective for making the compsn. alkali-soluble in an exposure with chemical. rays is used as the sensitizer. In the formulae, R is H, halogen, etc., R' is silyl and each of (n), (n') and (m) is a number of >2. A resinproduced by allowing phenol to react with peroxidase in the presence of a peroxide or with oxidase in the presence of oxygen in a medium contg. an org. solvent is preferably used as the phenolic resin. A diazoquinone compd. is preferably used as the sensitizer.
申请公布号 JPH02120743(A) 申请公布日期 1990.05.08
申请号 JP19890234502 申请日期 1989.09.08
申请人 MEAD CORP:THE 发明人 RONNCHIYAN RIAN;AREKISANDAA AARU POKORA;UIRIAMU ERU SHIRASU JIYUNIAA
分类号 G03F7/039;G03F7/075;H01L21/027 主分类号 G03F7/039
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