| 摘要 |
PURPOSE:To increase the strength of the title bonding wire so that the wire can be made extremely thinner, improved in fracture strength, and reduced in disconnection by constituting the bonding wire to have a specific chemical composition. CONSTITUTION:A bonding wire is constituted of (1) 1-5wt.% Cu, with the rest being Au; (2) 1-5wt.% Cu and 0.0003-0.01wt.% in total of more than one or two of Ca, Ge, Be, La, and In, with the rest being Au; (3) 1-5wt.% Cu and 1-5wt.% Pt, with the rest being Au; or (4) 1-5wt.% Cu, 1-5wt.% Pt, and 0.0003-0.01wt.% in total of more than one or two of Ca, Ge, Be, La, In, with the rest being Au. In addition, the diameter is 20mum or smaller, and the fracture strength is 4g or greater. |
