| 摘要 |
<p>PURPOSE:To obtain an equipment which can push up a semiconductor wafer in such a way that bending angles in individual positions of its breaking lines are definite by installing an arc-shaped pushing-up mechanism where bending stresses in the individual positions of the breaking lines of the semiconductor wafer are nearly definite during a breaking operation. CONSTITUTION:In a wafer breaking equipment where a semiconductor wafer 1 is pushed up in a state that it is fixed to a tape 2 and the wafer is divided into individual dice along breaking lines 6, 8 formed in the wafer 1, an arc- shaped pushing-up mechanism where bending stresses in individual positions of the breaking lines 6, 8 in the semiconductor wafer 1 become nearly definite during a breaking operation is installed. For example, the following are installed: a wafer frame 3 to support a tape 2 where a semiconductor wafer 1 has been fixed; balls 10 forming the tip of a pushing-up pin used to break the semiconductor wafer 1 via the tape 2; a ball-fixing tool 11 to arrange the balls 10 to be arc-shaped; a cam 12 to give a pushing-up displacement to the ball-fixing tool 11.</p> |
