| 摘要 |
PURPOSE:To eliminate the necessity of reducing the widths and pitches of outer leads and reduce the manufacturing cost of a container for a semiconductor package by a method wherein a protrusion is formed on the bottom part of the container and the outer leads are attached to the respective steps of the protrusion. CONSTITUTION:A semiconductor element 1 is placed in the cavity 9 of a container 2 made of ceramics and connected to inner wirings 7 provided around it with bonding wires 3. The inner wirings 6 are drawn out of the container 2 as outer leads 6A and 6B provided on the steps of the bottom part of the container 2 which is so formed as to have a protruding shape through side wirings 8. The leads 6B are provided on the protrusion 2A so as to be in parallel with the bottom surface and the tip parts of the leads 6A provided or the upper step are bent so as to be in the same plane with the leads 6B. With this constitution, the outer leads can be provided over the two steps and the necessity of reducing the widths and pitches of the leads can be eliminated, so that the manufacturing cost of the container can be reduced. |
