| 摘要 |
<p>An improved flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a higher percent of halogen (which can be part of the resin or the hardener), preferably the polyglycidyl ether of the bromophenol-formaldehyde novolac type, preferably containing at least about 1.0 % of bromine by weight of the molding compound, a lower percent of sodium, preferaby in the range of 0.01-0.06 % by weight of the antimony pentoxide, a lower percent of antimony pentoxide, preferably in the range of « about 0.8 % by weight of the molding compound, and an amount of bismuth trioxide « about 4.0 % by weight of the molding compound. The improved flame retardant epoxy molding compounds when used to encapsulate semiconductor devices have improved high temperature stability and compatability, ball-lift performance, live-device performance, cost and lower toxicity compared to similar prior art molding compounds.</p> |
