| 摘要 |
PURPOSE:To prevent a bonding wire and a chip from being electrically short- circuited due to an Al film at the time of an assembly by making the length of the successive Al film to remain along a chip sidewall into a prescribed value or below. CONSTITUTION:When a removed part 5 of a dicing line 7 is machined by a dicing plate, the Al film of an alignment mark 3 forming material to remain along a chip sidewall 6 is also machined, and simultaneously, the Al film is made into a condition to be wound into the dicing plate and peeled. However, at the time of a division into chips, since the lengths of the Al film, etc., made to remain along the chip sidewall 6 is set so as to be 30mum or below, even when a part 54 of a remaining member made of the Al film, etc., is peeled, the bonding wire and chip can be prevented from being short-circuited through the Al film at the time of the assembly. Thus, the electric short-circuit cannot be caused. |
