| 摘要 |
<p>PURPOSE:To obviate a welding (joining) process by a method wherein a light emitting device and an photodetector are mounted on one lead frame, the light emitting device and the photodetector are opposedly positioned by bending a part of the lead frame, and it is coated with resin in this opposedly positioned state. CONSTITUTION:A light emitting device 11 and a photodetector 12 are die-bonded to a lead frame 10 with silver paste, and it is internally connected by a bonding wire 19. The light emitting device 11 is precoated with silicon resin. Next, the lead frame 10 is inserted to a primary mold die 25. Then, the movement section 26b, 27b of dies 26, 27 are moved in the X direction, at the same time the center Z of a tie-bar 17 of the lead frame 10 is bend by a bending punch 28 so that the light emitting device 11 and the photodetector 12 oppose each other. The movement sections 26b, 27b are moved in the Y direction, the lead frame 10 is fixed to the primary mold die 25, and a primary mold body 29 is formed by light transmissive resin.</p> |
