| 摘要 |
PURPOSE:To realize densification and high integration by providing 2 islands to which a circuit wiring substrate for mounting elements are sticked at fixed intervals, and adhering the circuit wiring substrate to each of the islands. CONSTITUTION:Two islands 3 of a lead frame are arranged at intervals, e.g., 3mm, and circuit wiring substrates 1 are adhered to each of the islands. Leads 2 for terminals are made up alternately so that they can be connected from the respective wiring substrates. Thereby, it is possible to constitute the circuit of 2 sheets of circuit wiring substrates 1 and double an allowable area for stretching a wire around, and also realize densification and high integration. |
