| 摘要 |
<p>PURPOSE:To enable fixing easily and correctly a component requiring flatness by making a recession to apply bond at the center of a pattern and adhering the component on the pattern coated by a coating material with the bond applied to the recession. CONSTITUTION:A recession 9 is made at the center of a dummy pattern 2b where bond 4 to adhere a component such as a sheet coil 5 is applied. Therefore, unevenness caused by the thickness of the bond 4 can be prevented and the sheet coil 5 is mounted on resist 3 of a coating material on the dummy pattern 2b and adhered on to a printed circuit board 1 with the bond 4 in the recession 9 by forming the dummy pattern 2b evenly on the surface to which the sheet coil 5, etc., is adhered to unify the height and applying the bond 4 to the recession 9 of the dummy pattern 2b.</p> |
