| 摘要 |
A method is provided for adhering a shrink sheet floor covering to subflooring using a double-faced adhesive tape applied along the perimeter of the subflooring, as well as a composition therefor. The adhesive tape includes a substrate having on each side an adhesive layer. One of the adhesive layers is bonded to the subflooring, and the other adhesive layer is bonded to the shrink sheet floor covering. The adhesive layer bonded to the floor covering is tolerant to plasticizer migrating from such covering. Migration of plasticizer to the adhesive layer bonded to the subflooring is prevented by means of the adhesive tape substrate layer, which is substantially impermeable to plasticizer migration. The adhesive tape is applied only along the perimeter of the subflooring, allowing the shrink flooring material to shrink freely at all points within the perimeter after application to the subflooring. |
