| 摘要 |
<p>PURPOSE:To make the complete correction of warpage possible by a method wherein each cooling plate is formed to be a hollow box-like body and is deformed concavely and convexly by controlling the pressure of fluid, which flows in and out of the hollow part of the cooling plate. CONSTITUTION:In the warpage correcting device for printed wiring board, each cooling plate 5 is formed to be a hollow box-like body. The cooling plate 5 is deformed concavely and convexly by controlling the pressure of fluid, which flows in and out of the hollow part 6 of the cooling plate 5. Printed wiring boards A are fed in a heating furnace 2 with a conveyer 3 for heating and pressed between the cooling plates 5 so as to be concavo-convex. At the correction of the warpage of the printed wiring board A by being pinched between the cooling plates 5, the warpage of the board can be completely corrected by pinching the printed wiring board A between the cooling plates 5, the surface of which coming into contact with the concavely curved surface of the printed wiring board is deformed convexly and the surface of which coming into contact with the convexly curved surface of the board is deformed concavely under the conditions that the degree of curvature of both the deformations of the cooling plate is somewhat larger than that of the warpage of the printed wiring board.</p> |
