发明名称 BONDING DEVICE
摘要 PURPOSE:To make a lead frame movable and perform an efficient heating by forming a bonding stage with stainless steel showing a magnetic property and mounting a coil equipped with a heat resistance structure at the lower side of the coil. CONSTITUTION:A heat core 11 consists of stainless steel showing a magnetic property and a bonding stage 11a with which a lead frame 1 comes closely into contact is formed on the upper face of the core 11 and is installed on a heat block 15. A coil 14 is formed by winding conducters 12 to the heat core 11 and then, an electric magnet having the heat core 11 is formed. The heat core 11 is heated from a position directly below its heat core by the heat block 15 and it eventually results in a state where the lead frame 1 is heated from a position just under its frame 1 directly. After heating the lead frame 1 at a prescribed temperature, with bonding is performed. Ultrasonic wave oscillations are transmitted efficiently without causing the inner lead 1b to perform oscillatory motions and wire 3 is joined securely.
申请公布号 JPH02117146(A) 申请公布日期 1990.05.01
申请号 JP19880271212 申请日期 1988.10.27
申请人 MITSUBISHI ELECTRIC CORP 发明人 MIYAMOTO KOJI;TSUMURA KIYOAKI
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
主权项
地址