| 摘要 |
Apparatus is provided for effectively and precisely cutting metals, ceramics, composite materials and the like by use of a blade having an elongated metal band body and a conductive abrasive layer adhered to a cutting edge thereof, with an electrode disposed close to a side of the blade and a voltage difference is selectively applied continuously or intermittently between the electrode and the blade which is pressed against and reciprocated relative to the workpiece. A conductive processing fluid is supplied to a cutting portion between the blade and the workpiece and the processing voltage is continuously or intermittently applied to preferably provide a minus pole on the blade side and a plus pole on the work side. Electrolytic, electro-discharge and grinding operations are thus provided simultaneously, to thereby permit rapid and precise cutting of metals and other hard, brittle and difficult-to-cut materials whila maintaining the cutting effectiveness of the blade. In one aspect of the invention, the blade is also provided with an insulation layer on at least a metal surface, and the cutting effects are thereby improved. In another aspect of the invention an ultrasonic input is provided at the cutting position to further increase the cutting efficiency of the apparatus.
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