发明名称 DAMPING COMPOUND FOR SURFACE WAVE DEVICE
摘要 <p>An acoustically matched reaction resin compound for damping coating of surface wave components is disclosed that contains one or more epoxy resins, one or more dicarboxylic acids or polycarboxylic acids or, respectively, acidic esters of dicarboxylic acids or polycarboxylic acids, an aliphatic or hetero-aromatic amine in a proportion sufficient to catalyze the cross linking of the reaction resin compound, and a solvent. The number of amine hydrogen equivalents and acid equivalents together is less than the number of epoxy equivalents and the uniformly mixed reaction resin compound can be set to a predetermined viscosity and thixotropy required for the application. For example, the reaction resin compound can be applied onto the wafer containing the surface wave components in a silk screening process. Sharp contours can be produced that survive the curing process in an unmodified state. The damping properties of cured reaction resin structures are excellent; corrosion induced by the resin is noticeably reduced.</p>
申请公布号 JPH02115258(A) 申请公布日期 1990.04.27
申请号 JP19890239747 申请日期 1989.09.13
申请人 SIEMENS AG 发明人 HAINAA BAIYAA;MIHIAERU ROGARI;FURANKU DEITORITSUHI;HANSU SHIYUTERUTSURU
分类号 C08G59/56;C08G59/58;C08L63/00;G10K11/16;G10K11/36;H03H3/08;H03H9/25 主分类号 C08G59/56
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