| 摘要 |
PURPOSE:To inhibit the sticking of sputtered particles to the wall of a chamber and to prevent the generation of dust by circularly arranging substrates and substrate holders and setting targets and electrodes at the insides of the holders. CONSTITUTION:In this batch type sputtering device, substrates and substrate holders 2 are circularly arranged, targets 3 and electrodes 4 are set at the insides of the holders 2 and sputtering is carried out while rotating the holders 2. Since sputtered particles from the targets 3 do not stick to the wall 1 of the chamber, the generation of dust, etc., due to the exfoliation of a film formed by sputtering is minimized. |
