| 摘要 |
PURPOSE:To realize high density mounting on a printed board by mounting gate array integrated circuit chips on the upper and lower surfaces of an LSI package. CONSTITUTION:Separate gate array integrated circuit chips 5 and the switches of leads in islands 4 in the upper and lower surfaces of an LSI package 1 are bonded to the islands 4 by wire-bonding. With this constitution, two gate array integrated circuit chips can be mounted in one LSI package. Therefore, the mounting density of the gate array integrated circuits on a printed board can be improved. |
