发明名称 MANUFACTURE OF LAMINATED CERAMIC ELECTRONIC COMPONENT
摘要 <p>PURPOSE:To obtain the title laminated ceramic electronic component on which a transfer operation can be performed while its mechanical strength is maintained by a method wherein, after a supporting body on which an electrode ink is formed has been coated with a slurry, in which a specific quantity of thermoplastic resin is blended after it is dried up, the slurry is dried up, and electrode-buried ceramic raw sheet is formed, and it is transferred to the electrode. CONSTITUTION:A heating plate 27, which is heated up by a heater 26, is placed on the side where the electrode-buried ceramic raw sheet 25 of a base film 21a is not formed. On the other hand, a base film 21, which is fixed to a stand 20, and a ceramic raw laminated body 22 are placed on the side where the electrode-buried ceramic raw sheet 25 is formed. Then, the electrode-buried ceramic raw sheet 25, formed on the surface of the base film 21a, is press- bonded by heating on the surface of the ceramic raw laminated body 22 using the heating plate 27. The electrode-buried ceramic raw sheet 25 on the base film 21a is transferred to the surface of the ceramic raw laminated body 22 using a heating plate 27, and an electrode-buried ceramic raw sheet 30 is formed.</p>
申请公布号 JPH02114615(A) 申请公布日期 1990.04.26
申请号 JP19880268458 申请日期 1988.10.25
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NAKAO KEIICHI;OKINAKA HIDEYUKI;HORIBE YASUTAKA;OKUYAMA HIKOHARU;KATO MASAHIRO;OOMI SATOSHI;IGUCHI TAKASHI;MIURA KATSUYUKI
分类号 H01G4/12;H01C7/10;H01G4/30;H05K1/16 主分类号 H01G4/12
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