| 摘要 |
PURPOSE:To easily release a resist and to secure the close adhesiveness of the resist by coating a substrate with the first resist having the high close adhesiveness to the substrate so as to surround a driving element mount part and further applying the second resist having low close adhesiveness so as to cover the driving element mount part. CONSTITUTION:The first resist 9 is applied to a substrate 2 and, as said resist 9, one having the relatively high close adhesiveness to the substrate 2 is used and applied so as to surround a printing element part A and a driving element mount part B. Further, the second resist 10 is applied to the substrate 2. As said resist 10, one having the relatively low adhesiveness to the substrate 2 is used and covers the whole of the printing element part A and the driving element mount part B. The peripheral edge part 10a of the second resist 10 is overlapped with the first resist 9. In this state, plating treatment is applied to the substrate 2 to perform the plating of terminals 5a, 8a. Since the close adhesiveness of the first resist 9 with the substrate 2, is high a plating solution is prevented from penetrating into the driving element mount part B from the space between them. After plating treatment is finished, the second resist 10 is mechanically released to expose the printing element part A and the driving element mount part B. |
