| 摘要 |
PURPOSE:To easily surface-mount an element perpendicularly to the surface of a circuit board and to surely maintain an electrical connection to the circuit board even by being subjected to a temperature change by a method wherein lead frames protrude outward in perpendicular directions from the surface and the rear of the board at an end part of the board. CONSTITUTION:Protruding parts 5a of lead frames 5 protrude outward in perpendicular directions from the surface 2 and the rear 7 of a board 1 at an end part 6 of the board 1. Accordingly, when a magnetoresistance element is surface- mounted on the circuit board 1, the protruding parts 5a function and the magnetoresistance element is erected by itself on the surface of the circuit board. In addition, even when a temperature change is caused in a mounted state and a stress strain by a difference in a coefficient of thermal expansion between a substrate of the magnetoresistance element and the circuit board 1 is caused, a solder used to connect electrodes 4 to the lead frames 5 and the lead frames absorb a mechanical stress. Thereby, it is easy to mount the element perpendicularly; reliability of an electrical connection is enhanced. |
