发明名称 CONNECTION OF WIRE BONDING
摘要 PURPOSE:To set a bonding characteristic to an electrode pad on the side of a second bond at a level identical to that on the side of a first bond and to enhance a life as a whole when a bonded part is left at a high temperature by a method wherein a metal ball is formed in advance in a wedge bonding part in a pellet-pellet bonding operation. CONSTITUTION:An Au ball 7 is formed in advance on an Al electrode pad for a second bond of a second pellet 2. Then, a metal ball is formed again on an Au wire of a bonder; this ball is ball-bonded to one end 8a of a metal thin wire 8 at a first bond of a first pellet; the other end 8b of the Au wire 8 is wedge-bonded and connected to the Au ball 7 which has been formed before at the second bond of the second pellet 2. Thereby, it is possible to relax a mechanical impulsive force during a wedge bonding operation on the side of the second bond; especially regarding a life at the time when a bonded part is left at a high temperature, it is possible to obtain a wire bonding connection of sufficient reliability.
申请公布号 JPH02114545(A) 申请公布日期 1990.04.26
申请号 JP19880267509 申请日期 1988.10.24
申请人 TOSHIBA CORP 发明人 KATO TOSHIHIRO
分类号 H01L21/60 主分类号 H01L21/60
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