| 摘要 |
PURPOSE:To manufacture the title electronic component capable of enhancing the soldering quality and cutting down the total cost by a method wherein spare solders for direct soldering a chassis, printed substrates, etc., are formed in specific thickness. CONSTITUTION:A solder plated layer 8 comprising tin and bismuth as spare solder is formed in thickness of around several scores of microns by electrolating process using rotary barrel, etc. Next, the plated layer parts formed on both ends 6-a, 6-b of a stepped barrel type dielectric ceramic 6 are removed by grinding process. Then, the underneath electrode layer 7 and the solder plated layer 8 are respectively isolation-formed into 7-a, 7-b and 6-a, 8-b only. Furthermore, it is recommended that the thickness of the solder plated layer shall be specified within the range of 20-100mum conforming to the shape of electronic part or the shape and size of a chassis, etc., to be mounted. |
