发明名称 ABUTMENT WORKING METHOD FOR INSULATING BOARD FOR BUILDING
摘要 PURPOSE:To enable the thickness of abutment parts to be molded into a desirable thickness by heating the edge part of a thermoplastic resin foam laminated with a thermoplastic resin film as required, and conducting the edge between rotating caterpillars for compressing them. CONSTITUTION:Thermoplastic resin films 2, 2 are laminated on the both surfaces of a forwarded thermoplastic resin foam 1, and in the abutment formed parts 3, 3 of the respective films 2, 2, the films 2, 2 may not be laminated on the recessive parts as compressed. Although the foam is heated prior to being compressed by caterpillars, the heating is carried out at high temperature for the recessive side by compression, and also carried out at low temperature for opposite side thereby. The heating temperature is set to be 150-400 deg.C at high temperature side, and 130-380 deg.C at low temperature side. On the left and right sides of the laminated sheet, each pair of caterpillars 5, 5 are disposed for compressing them. An obtained heat insulating board 7 for building has abutment parts 6, 6 having sharp angled parts formed on the edged parts of the front and rear surfaces thereof.
申请公布号 JPH02112923(A) 申请公布日期 1990.04.25
申请号 JP19880266867 申请日期 1988.10.22
申请人 JSP CORP;WAKAIRO INSATSU KK 发明人 KITAHAMA TAKU;WAKAIRO SHOZO;YAMAMOTO JO
分类号 B29C59/04;B29K105/04;B29L9/00;B29L31/10 主分类号 B29C59/04
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