| 摘要 |
PURPOSE:To prevent troubles, which are caused by a metal thin film for peeling use, from generating by a method wherein the layer to come into contact with a temporary substrate among layers constituting the metal thin film for peeling use is used as a layer having a good adhesion to said temporary substrate and the layer to come into contact with a resist among the layers is used as a layer having a good adhesion to the said resist. CONSTITUTION:A metal thin film 2 for peeling use is formed of two layers 2a and 2b or more on the surface of a temporary substrate 1, the layer to come into contact with the substrate 1 among the layers is used as a layer 2a having a good adhesion to said temporary substrate and the layer to come into contact with a resist 3 among the layers is used as a layer 2b having a good adhesion to said resist. Accordingly, on the way to the formation of a printed-wiring board, the generation of swelling and peeling of the film 2 and the generation of loosening and peeling of the plated resist are prevented. Thereby, the generation of troubles, which are caused by the film 2, can be prevented. |
