| 摘要 |
PURPOSE:To prevent chip-type electronic component elements from cracking and production of inferior products by applying paste of electrodes or the like on one end face of each chip-type electronic component element while aspirating or attracting the other end face of the element by means of a holding plate. CONSTITUTION:A holding plate 4 consisting of a magnet plate adapted to attract one end face of each laminated capacitor element is prepared. One surface of the holding plate 4 is brought close to the recessed surface of a guide plate 2 having recesses 2 in which the laminated capacitor elements 3 are received, so that the laminated capacitor elements 3 are attracted and held by the magnetic force of the holding plate 4 that is the magnet plate. The other end faces of the laminated capacitor elements 3 thus held by the holding plate 4 are dipped in an Ni electrode paste 5 the surface of which has been flattened previously, so that the end faces are coated with the paste. The paste is heated and dried to provide outer electrodes. According to such method, the delamination or cracking in the chip-type electronic component elements can be prevented without the production of inferior products. |
