Moulding composition comprising a thermoset component and thermoplast component.

摘要

A curable moulding composition in the form of a flowable particulate solid substantially non self-adhesive at temperatures up to 60 DEG C, flowable under shear and self-adhesive at temperatures in the range 60-150 DEG C and hardenable at temperature over 150 DEG C, said composition comprising an uncured or partly cured thermoset resin precursor and, mixed intimately therewith, a polyarylsulphone containing the repeating units (Ph SO2 Ph)n and Ph<1>a linked through ether and/or thioether, where Ph is paraphenylene, Ph<1> is phenylene, n is 1 to 2 a is 1 to 3 and groups Ph<1> are (when a exceeds 1) linked through a single chemical bond or a divalent group other than SO2 or alkylene or are fused together. Preferably the polyarylsulphone contains end-groups of formula -D-Y where D is a divalent aromatic hydrocarbon group and Y is a group reactive with the thermoset precursor and has been incipiently reacted with the thermoset precursor.