| 摘要 |
PURPOSE:To assure the creeping-up property of solder in order to prevent the soldering defect by covering an electronic component element, to which a lead terminal is connected, with a packaging resin and cutting the extremity of a hanging part of the resin adhering to the base part of the lead terminal obliquely with respect to the lead terminal and removing it. CONSTITUTION:After a lead terminal 2 is soldered to a varistor element, dip coating with an epoxy resin is carried out, then the epoxy resin is semi-cured and the extremity of a resin hanging part 4 is cut at an angle of about 45 deg. with respect to the lead terminal 3 and is removed, then thermal curing is carried out to accomplish the complete curing to package the varistor element and provide removed parts 9. In this way, even in case a double sided wiring board is used, a clearance is assured between the double sided wiring board and the resin hanging part 4 so that a good creeping-up property of soler is assured and the reliability of the solderability can be improved. |
