| 摘要 |
PURPOSE:To prevent a metallic fine line from a sagging phenomenon and an initial bend of the metallic fine line as well as a bend which is developed after sealing its line with a resin by providing each protrusion having the shape of a sliding way at the pointed end of each inner lead of a lead frame and providing each semicircle columnar groove for inserting a metallic line in the protrusion. CONSTITUTION:A protrusion 5 having the shape of a sliding way is provided at the pointed end of each inner lead 4 and a semicircle columnar groove 6 for insertion which is larger than a diameter of a metallic fine line 3 and is smaller than a length that is 3 times its diameter is formed in each inner lead. In this way, each metallic fine line is connected to an electrode formed on a semiconductor element 2 as the first bonding. When the second bonding is performed on the prescribed position of the inner lead 4, its fine line 3 is lifted by a reaction from coming in touch with protrusion 5. This step not only prevents sagging phenomena of its fine lines 3 but also allows the fine lines 3 to be supported by the grooves 6 provided in the protrusions 5. Bends of these lines are thus prevented. |
