| 摘要 |
PURPOSE:To make a temperature change difference between the end and the center of a printed wiring board small at the laminate molding of the printed wiring board, to enable the reduction of manhours for setting a laminating condition, and to shorten a laminating time by a method wherein metal whose thermal conductivity is different from that of a laminating jig is fitted to a plane of the laminating jig which is not in contact with a printed wiring board. CONSTITUTION:A laminating jig (top force) 1 and a laminating jig (bottom force) 2 are provided with a laminating jig metal plate 11 of a carbon steel plate 10mm in thickness, and guide holes 4, into which guide pins 5 are inserted to fix a printed wiring board to the metal plate 11, are provided to the metal plate 11. Moreover, a recessed part 31a, to which a temperature adjusting metal plate 3a is fitted, is provided to the face, which is not in contact with a printed wiring board, of the metal plate 11 of the laminating jigs 1 and 2. When the rate of temperature rise of the center of the printed wiring board is required to be high, the temperature adjusting metal plate 3a is formed of a metal plate whose thermal conductivity is higher than that of the laminating jig metal plate 11, and reversely, when the rate of temperature rise of the end of the printed wiring board is needed to be high, the temperature adjusting metal plate 3a is formed of a metal plate whose thermal conductivity is lower than that of the laminating jig metal plate 11. |
