发明名称 METHOD AND APPARATUS FOR MOLDING WITH RADIATION CURING RESIN
摘要 PURPOSE:To make it possible to pour resin without entraining voids at the pouring of the resin by a method wherein the clearance between a base plate and a mold is enlarged so as to make the filling space of resin at the filling of the resin larger by the cure shrinkage amount of the resin and, after the filling of the resin, the clearance is reduced by clamping the mold by the cure shrinkage amount of the resin. CONSTITUTION:A resin filling space 3 is further opened in excess by the clearance 16 between a top force and a bottom force so as to allow to fill ultraviolet-curing resin between a transparent acrylic plate 2 and a pressing mold core block 1 in excess by the cure shrinkage amount of said resin. The clearance 16 between the top force and the bottom force is calculated on the relationship between the cure shrinkage of the ultraviolet-curing resin and the molding thickness of the resin. Under the above- mentioned condition, the valve 10 at a resin outlet 15 and the valve 10 at a resin inlet 14 are opened so as to fill the resin from the resin inlet 14 in the resin filling space 3. Since somewhat air is entrained at the tip part of resin flow at the filling of the resin, the air-entrained resin at its tip part is overflowed from the outlet 15. After that, the forces are clamped together so as to bring the clearance 16 between the top force and the bottom force to zero.
申请公布号 JPH02111509(A) 申请公布日期 1990.04.24
申请号 JP19880263904 申请日期 1988.10.21
申请人 HITACHI LTD 发明人 YOKOTA SHOJI;AMANO YASUO;YOSHII MASAKI;UEDA KOJI
分类号 B29C39/40;B29L11/00 主分类号 B29C39/40
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