Low stress light-emitting diode mounting package

摘要

A light-emitting diode is mounted in the bottom of a cavity in a metal lead and the assembly is potted in a transparent plastic material. The walls of the cavity surround the sides of the light-emitting diode in sufficiently close proximity to effectively shield the light-emitting diode from thermal expansion stresses from the plastic potting material which would induce light output degradation. Such a cavity may be a right-circular cylinder with a diameter less than 75 micro-meters greater than the largest transverse dimension of the light-emitting diode. The front face of the light-emitting diode may be flush or beneath the face of the metal lead for minimizing stress. The cavity may be deep enough that the front face of the light-emitting diode is closer to the bottom of the cavity than to its open end. The front face may protrude beyond the open end of the cavity and be surrounded by a reflective surface. The edges of the front face of the light-emitting diode may be beveled for minimizing stress.