| 摘要 |
<p>PURPOSE:To make it possible to use a base metal for a lead-out electrode, and to obtain the manufacturing method for a resistor on which heat-resistivity to soldering is improved by a method wherein base metal paste is coated on a resistance film, which is baked in the air, partially overlapping the edge part, a lead-out electrode is formed by baking in a reducing atmosphere, and heat-resisting resin is coated on the overlapped part of the resisting film and the lead-out electrode. CONSTITUTION:A resistance film 12 is baked on an insulated substrate 11 in the air, base metal paste is coated partially overlapping the edge part of the resistance film 12, the base metal paste is baked in a reducing atmosphere at the temperature lower than the baking temperature, and lead-out electrodes 13 and 14, which are partially overlapping the edge part of the resistance film 12, are formed. Besides, a heat-resisting resin 15 is coated on the overlapped part of the resistance film 12 and the lead-out electrodes 13 and 14. For example, using RuO2 paste as the material of the resistance film 12, a resistance film 12 is formed by screen-printing said paste at 800 deg.C, it is baked at 600 deg.C in a nitrogen atmosphere using a Cu electrode as the lead-out electrodes 13 and 14. Besides, phenol resin paste is screen-printed on the resistance film 12 including the lead-out electrodes 13 and 14, and they are hardened at 200 deg.C and coated with heat-resisting resin 15.</p> |
