| 摘要 |
<p>PURPOSE:To enable a board to be produced with improved yield by soldering while generating self-alignment by applying vibration to a member to be soldered while the soldering material is heated and fused. CONSTITUTION:A printed-circuit board 1 where a cream solder 3 is applied to and a flat package IC 4 is placed at a specified position is carried to a reflow furnace 6 by a belt 7 and is heated. Then, after preheating, the printed- circuit board 1 is heated at a temperature exceeding the melting point of the cream solder 3 and a vibrator 8 is operated when the printed-circuit board 1 is heated to a certain temperature, thus heating the printed-circuit board 1 while applying vibration to it in the direction of gravity. Thus, self-alignment can be generated even if the flat package IC 4 is large and soldering can be performed, thereby allowing the printed-circuit board to be produced with improved yield.</p> |
