| 摘要 |
<p>PURPOSE:To enable the sure bonding of electronic components and to shorten a mounting process by a method wherein a combined ultraviolet curing-thermosetting resin is applied so as to cover the edge of a component main body mounting area, an electronic component is mounted on a circuit substrate, and then the substrate is irradiated with ultraviolet rays and then heated. CONSTITUTION:A combined type ultraviolet curing-thermosetting resin 5 is applied onto four corners of an area of a circuit substrate, where a component main body 7 of a flat package type electronic component 3 is mounted, covering a part other than the component mounting area, and furthermore a bonding agent 6 is applied onto the center of the mounting area. Next, the component main body 7 of the electronic component 3 is mounted on the mounting area of the circuit substrate 1, and the corners and the center of the component main body 3 are made to bear on the bonding agent 5s and 6 respectively. As the component main body is kept in this state, the bonding agent 5s are irradiated with ultraviolet rays to enable their surfaces to set almost keeping their shapes as they are before the irradiation. In succession, the bonding agents 5s and 6 are heated to set to fix the component main body to the circuit substrate 1. Thereafter, a soldering process follows after.</p> |
