| 摘要 |
PURPOSE:To repair the disconnection of a very fine conductive pattern due to the lack of a conductive film by a method wherein the thick film paste on a specified region corresponding to the disconnected part of the conductive pattern is irradiated with laser rays to be selectively burned. CONSTITUTION:When a repairing operation is made to connect a disconnected part 14 occurred in a part of wirings 13 of a conductive pattern due to the lack of an Au conductive film, organic Au paste 15 of thick film paste is applied onto a region which includes the disconnected part 14 on an insulating substrate. Next laser rays possessed of an irradiation area 10mum or so in diameter are made to irradiate the organic Au paste 15 on the specified region corresponding to the disconnected part 14 to burn only the organic Au paste 15 selectively defined on the specified region. The solvent contained in the organic Au paste 15 is evaporated and thermally decomposed to turn the organic Au paste 15 locally into metal Au, which forms a conductor on the disconnected part 14 to repair the disconnection. Thereafter, the organic Au paste 15 not irradiated with laser rays is removed through an organic solvent such as n-butyl acetate or the like. |
