| 摘要 |
PURPOSE:To minimize a metallic wire length, improve reliability and reduce the manufacturing cost by dividing the surfaces of transistor elements into the first and second electrode regions and forming a plurality of bonding pads in the second electrode region. CONSTITUTION:The surface of each transistor element 7 is divided into emitter and base electrode regions 11 and 10. Then a plurality of bonding pads 8 and 9 are formed in the base electrode region 10. In this way, base leads 2 are connected to base electrode regions with metallic wires 5 in the whole transistor elements 7 on chip mounting parts 3a. In such a case, utilization of the bonding pads which are nearest to the base leads 2 allows a metallic wire length to be shortest. |
