| 摘要 |
<p>PURPOSE:To ease electrical connection and improve reliability in assembling an IC card by disposing an external connection terminal on one surface of an insulating substrate including therethrough a through-hole and an integrated circuit element on the opposite surface of said substrate, connecting said external connection terminal and said integrated circuit element with each other through said through-hole, covering said circuit element and said connection portion with sealing resin, and forming a resin corner section into a curved surface. CONSTITUTION:A through-hole 11a is provided through an insulating substrate 11, and a wiring board 10 is formed which includes a conductor exposed portion 12b on the opposite surface of an external connection terminal surface 12a of a conductor 12a. Then, an integrated circuit element 13 is mounted on the wiring board 10 at a predetermined position of the same opposite to the conductor 12 of the insulating substrate 11 through a connection member 14 comprising insulative resin, and an adhesive material 14 is heated and hardened for adhesion and fixation of the insulated circuit element. Further, there is performed electrical connection required for an input/output electrode 13a of the integrated circuit elements 13a and the conductor exposed portion 12b of the wiring board 10. Thereafter the integrated circuit element 13, a metal wire 15, and the one surface of the insulating substrate 11 are covered with sealing resin 16 for protection thereof. Thereupon, a corner portion 16a of the sealing resin 1 on the opposite surface of the insulating substrate 11 is formed into a curved surface. Hereby, the device can avoid the damage of the circuit elements thereof even when it is assembled into an IC card and folded.</p> |
