发明名称 THICK FILM HYBRID INTEGRATED CIRCUIT
摘要 <p>PURPOSE:To prevent a glass insulation formed on a resistor from being damaged and prevent the resistance from the fluctuation by a method wherein the glass insulation is protected with a material which absorbs impact. CONSTITUTION:Thick film conductors 3 are formed on a ceramic substrate 5 by printing. Then, a thick film resistor 4 which is connected to the conductor 3 is formed by printing and, further, a glass insulation 2 is formed on it by printing. Then, a printed resin unit 1 is formed on the glass insulation 2 on the thick film resistor 4. With this constitution, the damage of the glass insulation 2 on the thick film resistor 4 can be avoided and the fluctuation of the resistance can be avoided.</p>
申请公布号 JPH02112201(A) 申请公布日期 1990.04.24
申请号 JP19880263908 申请日期 1988.10.21
申请人 HITACHI LTD 发明人 ENDO KAZUMASA;YAMAGISHI YASUYOSHI
分类号 H01C17/24;H01C7/00;H05K3/28 主分类号 H01C17/24
代理机构 代理人
主权项
地址