发明名称 |
Cooling system for an electronic circuit device |
摘要 |
A cooling system including a cooling module which has a heat transfer plate that is exposed to a flow of coolant and is elastically biased toward a circuit component on a printed circuit board for transferring heat dissipated by the component to the coolant. A series of projections are provided on the heat transfer plate for producing turbulence in the flow of coolant. Alternatively, a cylindrical tubular plate is mounted on the heat transfer plate for increasing the surface area in contact with the flow of coolant.
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申请公布号 |
US4920574(A) |
申请公布日期 |
1990.04.24 |
申请号 |
US19870079876 |
申请日期 |
1987.07.30 |
申请人 |
FUJITSU LIMITED |
发明人 |
YAMAMOTO, HARUHIKO;SUZUKI, MASAHIRO;UDAGAWA, YOSHIAKI;NAKATA, MITSUHIKO;KATSUYAMA, KOJI;ONO, IZUMI;KIKUCHI, SHUNICHI |
分类号 |
H01L23/433;H01L23/473;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/433 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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