| 摘要 |
<p>PURPOSE:To form a bump with a prescribed height in a state having no irregularity and at a low cost by a method wherein a plateaushaped bump base with a prescribed thickness is formed by a plating method, this bump is pressed with a shaping tool provided with a shaping recessed part and an upward protruding bump is formed. CONSTITUTION:A plateau-shaped bump base 2 whose plane shape is nearly rectangular is formed on the surface of an IC chip 1 by a plating method. Then, a shaping tool 3 is shifted toward the bump base 2; this bump base is pressed; a part corresponding to a shaping recessed part 4 protrudes upward; a bump 5 with a prescribed height H is formed. During this process, since a diameter of a plane shape at an opening part of the shaping recessed part 4 is formed to be smaller than a short side of the bump base 2 and a pulling-out slope is formed, a thick part of the bump base 2 in a region surrounded by an opening edge at the lower end of the shaping tool 3 smoothly flows into the shaping recessed part 4; the bump 5 can be formed stably and with good accuracy.</p> |
