发明名称 DETECTING DEVICE FOR HEIGHT OF BONDING FACE
摘要 <p>PURPOSE:To enable stable detection of a bonding face height by providing a proximity sensor at a vertically moving block with a rotatably set bonding arm. CONSTITUTION:A lever 10 equipped with a bonding arm 4 rotatably mounted at a vertically moving block 3 of a bonding device, a stopper 11 and a sensor detection face 10a both of which are set for the block 3 is integratedly turn around a shaft 2, and a sensor mounting block 13 provided with a proximity sensor 14 mounted thereon, the block 3 and a stopper 12 of the block 3 moves while turning. When a bonding tool 5 at the tip end of the arm 4 is brought into contact with a pellet 21 of a load frame 20, the arm 4 and the lever 10 is stopped in their turning, and the block 3 and a block 13 turns further, then the stopper 12 is spaced from the stopper 11, and at the same time the sensor 14 is spaced from a detection face 10a, and thus stabilization is made in a noncontact manner. As a result, the height of bonding face is detected, whereby good and reliable bonding operation can be done.</p>
申请公布号 JPH02109345(A) 申请公布日期 1990.04.23
申请号 JP19880260448 申请日期 1988.10.18
申请人 SHINKAWA LTD 发明人 OHASHI YUJI;TERAKADO YOSHIMITSU;TORIHATA MINORU;USHIKI HIROSHI
分类号 H01L21/60;B23K20/00;H01L21/00 主分类号 H01L21/60
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