| 摘要 |
PURPOSE:To improve adhesion between the surface of a board and a light sensitive film and to make it possible to reproduce a pattern in high quality by overlapping a film-shaped light sensitive film on an electrodeposited light sensitive film utilizing en electrophoresis phenomenon, thereby forming a pattern forming light sensitive film on the surface of the board. CONSTITUTION:A light sensitive film 3 comprises the following films: an electrodeposited light sensitive film 3a which is directly formed on the surface of a conductor layer 2 of a board 1 utilizing an electrophoresis phenomenon; and a film shaped light sensitive film 3b in a dry film type which is applied on the film 3a. Adhesion of the film 3a to the copper surface is better than that of the film 3b. The film 3a sufficiently follows streaks and dents on the surface and covers the wall surface of a through hole 5. When the film 3b is applied on the film 3a, adhesion between both films is high, and defects in a pattern after etching due to irregularities on the covered surface can be removed. The through hole 5 is covered in a tent shape, and intrusion of etching liquid can be prevented. Therefore, the high density pattern can be reproduced in high quality. |
