发明名称 THREE-DIMENSIONAL PRINTED WIRING BOARD
摘要 PURPOSE: To enable a number of three-dimensional printed circuit boards each having a rigid substrate part and a flexible connecting part, by integrally injection molding the substrate part and the thin connecting part by using a thermoplastic material to be economically provided. CONSTITUTION: Substrate parts 1 each having the thickness S of 0.9 to 1.6mm are bent at 90 or 180 degree from assembly auxiliary members 9 and 10 via flexible connecting parts 2 each having the thickness of 0.1 to 0.6mm and additional pieces 8 are pushed into corresponding through holes 7. Consequently, a three-dimensional box-shaped printed circuit board having the five rigid substrate parts 1 and the four flexible connecting parts 2 is provided. The substrate parts 1, the connecting parts 2, and the like can be formed as an integral injection molding part, so that the parts can be massively and economically manufactured. An amorphous thermoplastic can be also used as a material. In this case, the connecting parts re-solidify after the heating and bending operation.
申请公布号 JPH02109389(A) 申请公布日期 1990.04.23
申请号 JP19890235492 申请日期 1989.09.11
申请人 SIEMENS AG 发明人 HANSU EFUERU SHIYUMITSUTO;JIIKUFURIITO RAUFUMAURU;YURUGEN BETONARUTSU
分类号 C08L79/08;C08L81/02;H05K1/00;H05K1/02;H05K1/18;H05K3/00 主分类号 C08L79/08
代理机构 代理人
主权项
地址