| 摘要 |
PURPOSE:To obtain a high-reliability semiconductor-mounting construction without a bad influence on solder bumps, by providing protruding parts at four corners of carrier boards, making main solder bump connecting surfaces to have recessed bottom construction, and bringing the protruding parts into contact with surfaces other than the recessed bottoms. CONSTITUTION:Chip carriers 2 effective for unconnecting and semiconductor elements 1 connected with CCB solders 3 are lapped on a multilayered module board 5, and radiators 7 are attached to the backs. After the gaps between the chip carriers 2 and the semiconductor elements 1 are sealed with resin 4, and strain-suppressing protrusions 2a are formed beforehand, main connecting solder bumps 6 are formed, adjusted the positions to the pads of the board 5, melted by heated, and connected. In order that the pad parts of the board 5 on this occasion may be the recessed bottom parts 5a, parts other than the peripheries of the pad parts are constituted with a thin-film board beforehand; only the protrusions 2a of the carriers 2 are brought into contact with the upside of the thin-film board; and they are connected. In addition, in order to cool the generated heat of the semiconductor elements etc., and besides to increase the reliability protecting the characteristics of the elements, all the element- mounted area is sealed with a housing 8 and the board 5 by using sealing solder 9. |
