| 摘要 |
<p>PURPOSE:To make it possible to prevent solder of a semiconductor device of a surface mounting type from creeping up by a method wherein a groove is provided in the back side of an outside lead exposed from a semiconductor package and plating made on the outside lead is separated. CONSTITUTION:A groove 3 is provided on the back side of an outside lead 2 exposed from a semiconductor package 1 so that a sheathing plating 2a made on the outside lead 2 can be separated. The groove 3 machined on the outside lead 2 is machined with a die at the same time as molding process or before processing. In a semiconductor device constructed as above, a solder 6 to the outside lead 2 can be prevented from creeping up when a semiconductor device is mounted to a board 4 via the solder 6. As a result, the reliability of a semiconductor device is improved.</p> |
