| 摘要 |
PURPOSE:To make it possible to have excellent cooling performance by using a ceramic material which is the complex sinter of AlN and BN having a two-dimensional thermal conductivity, exhibiting a low thermal conductivity in a direction vertical to the two-dimension, and having excellent machinability such as cutting, grounding, and polishing. CONSTITUTION:A number of LSI chips 2 are mounted on a ceramic electrical wiring board 1. A heat cooling device 3 is incorporated between the chips 2 and a cooled body 4 cooled by an external cooler 5. Heat produced in these chips 2 flows through the heat transfer device 3 and the cooled body 4 in the direction of an arrow 6 and is carried out from the cooler 5. The device 3 is made up of a complex sinter of AlN and BN. A ceramic material having a two-dimensional thermal conductivity in a direction in which the heat of the LSI chips flow, exhibiting a low thermal conductivity in a direction vertical to the two-dimension, and having excellent machinability such as cutting, grounding, and polishing is used. Thus, a cooling apparatus for semiconductor chips having thermal conductivity performance according to the amount of heat produced in the LSI chips is obtained. |
