| 摘要 |
The invention relates to hybrid circuits, and more particularly to multilayer, complex hybrid circuits. In such a hybrid circuit, the substrate includes at least one mechanical support 1 and one surface layer 2, which are made of cosintered ceramic. According to the invention, a heating resistor 5 is screen-printed beneath the surface layer 2 beneath at least one component 3. Access to this resistor 5 is obtained via metallised holes 8, 9 and metallisations 6, 7, 10, 11 which connect the external circuit to the resistor 5. By heating, it is possible to solder the component 3 or to unsolder it by melting the brazing 4. Application to complex hybrid circuits. <IMAGE>
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