| 摘要 |
PURPOSE:To reduce the amounts of loads exerted on a semi-conductor device during insertion and pulling-out thereof, by making moveable its portion where the lead of the semiconductor device is fixed. CONSTITUTION:A portion where the lead of a semiconductor device is fixed is made moveable, i.e., its mechanism is such that a protruding portion 13 is pushed to move a sliding portion 12 horizontally so that the space between a metal plate 11 and the sliding portion 12 is alternatively opened or closed. In the case of insertion of the semiconductor device, the lead can be inserted into the device with the space between the metal plate 11 and the sliding portion 12 being opened, while in the case of pulling out the device the protruding portion protruding from the opposite side is forced back to open the lead to easily the lead. |
