| 摘要 |
PURPOSE:To form a three-dimensional metal pattern having increased electrical conductivity by successively forming an electrically conductive thin film, a plating layer and a patterned resist on the surface of a synthetic resin film and removing the parts of the plating layer and the electrically conductive thin film not covered with the resist. CONSTITUTION:The surface of a resin film 1 of polyimide, etc., is sandblasted with abrasive grains of about 180-300 mesh to increase the surface area. An electrically conductive thin film 2 of ITO, Cu, Ni, etc., is formed on the surface of the film 1 by dry plating such as ionic bombardment and a plating layer 3 of Cu, Ni, etc., is formed on the thin film 2. A resist 4 having a desired pattern is formed on the plating layer 3 with resist ink and the parts of the layer 3 and the thin film 2 not covered with the resist 4 are removed by sandblast or with an acid or alkali. A metal pattern suitable for a name plate, a printed circuit board, etc., is formed. |
